OFC Talk: Advanced Manufacturing
Mar 5, 2012		   Aurrion's platform allows the wafer-scale integration of active photonic devices by silicon foundries. A talk exploring this topic entitled, "Enabling a Complete Foundry Photonics Toolset with Heterogeneous Integration," will be presented by Aurrion's Vice President of Business Development, Dr. Eric Hall, at the OIDA's "Opportunities and Trends in Optoelectronic Manufacturing" workshop.
  
         
  OFC Talk: Silicon Photonics Impact
Mar 5, 2012		   Aurrion's heterogeneous integration platform combines emerging silicon photonics technologies with traditional III-V photonic materials to create a new class of advanced components. Dr. Greg Fish, Aurrion's Vice President of Research, will be presenting a view of the future for Aurrion's Heterogeneous Photonic Integrated Circuits at an OFC workshop entitled "What is the Impact of Silicon Photonics on Network Architecture?"
  
         
  Bowers Wins Tyndall Award
Nov 10, 2011		   Prof. John Bowers, Aurrion's co-founder and the Fred Kavil Chair in Nanotechnology at the University of California, Santa Barbara, has been awarded the Tyndall Award by the Optical Society (OSA) and the IEEE Photonics Society.

This award, which is the highest recognition in the optical communications community, recognizes Bowers' international leadership in the development of novel optoelectronic devices, including groundbreaking research in hybrid-silicon lasers and photonic integrated circuits. This hybrid technology lowers the costs of photonic sub-systems and allows optical communication technology to be applied to areas where it has been prohibitively expensive.

"John has been an active leader in the research and application of optical communications," said OSA CEO Elizabeth Rogan. "His work on hybrid-silicon lasers and computer circuitry sets the stage for the next generation of optoelectronic devices and paves the way for faster, more efficient optical communications technology."

Bowers will be presented the award during the plenary session of the 2012 Optical Fiber Communication Conference and Exposition/National Fiber Optic Engineers Conference (OFC/NFOEC) taking place at the Los Angeles Convention Center March 4–8. See full press release.

 
         
  Advancing Electronic-Photonic Integration
Nov 10, 2011		   Aurrion has been awarded a $13.9 million Defense Advanced Research Projects Agency (DARPA) multi-year R&D contract through the Electronic-Photonic Heterogeneous Integration (E-PHI) program. Working in collaboration with the University of California at Santa Barbara, the California Institute of Technology, the University of Virginia, the University of Washington and Rockwell Collins, Inc., Aurrion will develop new technologies and architectures for electronic-photonic integrated circuits on a common silicon substrate.

Dr. Greg Fish, Aurrion's Vice President of Research and the Principal Investigator, explained that the components developed in this program will not only meet the performance of native substrate devices but exceed them, leading to a dramatic enhancement in systems. "By combining the best photonic materials for the required functions closely integrated with electronics, we will demonstrate 3D chip scale systems that can achieve optical bench performance on a single silicon substrate using novel architectures that are conceived take to advantage of integration compared to discretely implemented designs," Dr. Fish said.

"E-PHI is enabling key More-than-Moore technologies. The key innovation is leveraging both CMOS and MEMS silicon processes to produce 3D heterogeneous electronic/photonic silicon circuits that use diverse materials for photonic components yet are still processed and interconnected at wafer scale."
  
         
  Aurrion adds Vice President of Operations
Aug 29, 2011		   Dr. Arnold Chen has joined Aurrion as the Vice President of Operations and will lead the expansion of Aurrion's manufacturing capabilities on its heterogeneous integration platform. The platform enables both advanced active and passive photonic devices to be fabricated using established silicon foundry infrastructure. Dr. Chen is an expert in the fabrication of optoelectronic photonic integrated circuits (PICs), joining Aurrion from Infinera where he managed chip fabrication.
  
         
  Datacenter Application
Apr 07, 2011		   UCSB and Aurrion have published a paper on photonic switching for datacenters in the IEEE Photonics Journal.